Q. What can be done for the fine grain protection of the processor?

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Q. Which of the following technique is used by the UNIX operating system?

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Q. Which of the following consist two lines of legs on both sides of a plastic or ceramic body?

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Q. Which package has high memory speed and change in the supply?

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Q. Which is a subassembly package?

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Q. What is the required voltage of DIMM?

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Q. Which memory package has a single row of pins?

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Q. What is the access time of MCM51000AP10?

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Q. Which is the very basic technique of refreshing DRAM?

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Q. How is refresh rate calculated?

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Q. Which is the commonly used refresh rate?

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Q. How can we calculate the length of the refresh cycle?

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Q. What type of error occurs in the refresh cycle of the DRAM?

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Q. What is the worst case delay of the burst refresh in 4M by 1 DRAM?

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Q. Which refresh techniques depends on the size of time critical code for calculating refresh cycle?

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Q. Which of the following uses a timer for refresh technique?

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Q. What is the main disadvantage in the software refresh of the DRAM?

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Q. Which refresh technique is useful for low power consumption?

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Q. Which refreshing techniques generates a recycled address?

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Q. Which of the following uses a software refresh in the DRAM ?

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